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8
Preliminary
GM5BW97331A
?SPAN class="pst GM5BW97331A_2663707_3">Reliability and Quality Information
Sharp tests to a Reliability Confidence Level of 90%. These tables illustrate the test criteria and conditions, along
with the Number of Samples, the Number of Defectives, and the Lot Tolerance Percent Defective.
?SPAN class="pst GM5BW97331A_2663707_3">Failure Judgement Criteria
*1 Measuring condition is in accordance with specification.
*2 U.S.L.: Upper Specification Limit.
*3 Solderability failure criterion: Fail if >90% solderability in plated test areas are not soldered.
Judgement areas are the bottom and sides as shown in Fig. 12.
No.
Test items
Test Conditions
Samples
(n)
Defective
(C)
LTPD
(%)
1  Temperature cycle
-40癈 (30 min) to +100癈 (30 min), 100 cycles   22
0
10
2  High temp and high humidity storage Tstg = +60癈, RH = 90%, t = 1000 hr
22
0
10
3  High temperature storage
Tstg = +100癈, t = 1000 hr
22
0
10
4  Low temperature storage
Tstg = -40癈, t = 1000 hr
22
0
10
5  Operating test
Tc = +40癈, I
F
= 25 mA/chip, t=1000 hr
22
0
10
6  Mechanical shock
15000 m/s
2
, 0.5 ms 盭 " 盰 " 盳 direction,
3 times (Tc = 25癈)
11
0
20
7  Variable frequency vibration
200 m/s
2
, 100 to 2000 to 100 Hz / sweep for
4 min. X " Y " Z direction, 4 times (Tc = 25癈)
11
0
20
8  Resistance to soldering temperatures Refer to the Soldering Profile; Performed twice   11
0
20
9  Solderability
Solder/flux M705/ESR250 (Senju Metal Indus-
try Co. Ltd.) Soldering temperature 245癈 ??
solder time 3 sec, 1 hr after Test 2 (above)
11
0
20
No.
Items
Symbol
Failure judgment criteria (*2)
1  Forward voltage
V
F
V
F
 > U.S.L ?1.2
2  Reverse current
I
R
I
R
 > U.S.L ?2.0
2  Luminous intensity (*3)
Iv
Iv < Initial value ?0.5, Iv > Initial value ?2.0
Fig. 12 Solderability Judgment Areas
Lead Bends
0.3
0.3
OTE: Units: mm 
0.3
-
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